Intragranular thermal fatigue of Cu thin films: Near-grain boundary hardening, strain localization and voiding

MLA

K. Hlushko, et al. “Intragranular Thermal Fatigue of Cu Thin Films: Near-Grain Boundary Hardening, Strain Localization and Voiding.” Acta Materialia, vol. 253, July 2023, p. 118961. EBSCOhost, https://doi.org/10.1016/j.actamat.2023.118961.

APA

K. Hlushko, T. Ziegelwanger, M. Reisinger, J. Todt, M. Meindlhumer, S. Beuer, M. Rommel, I. Greving, S. Flenner, J. Kopeček, J. Keckes, C. Detlefs, & C. Yildirim. (2023). Intragranular thermal fatigue of Cu thin films: Near-grain boundary hardening, strain localization and voiding. Acta Materialia, 253, 118961. https://doi.org/10.1016/j.actamat.2023.118961

Chicago

K. Hlushko, T. Ziegelwanger, M. Reisinger, J. Todt, M. Meindlhumer, S. Beuer, M. Rommel, et al. 2023. “Intragranular Thermal Fatigue of Cu Thin Films: Near-Grain Boundary Hardening, Strain Localization and Voiding.” Acta Materialia 253 (July): 118961. doi:10.1016/j.actamat.2023.118961.