A highly integrated dual-band tri-mode transceiver chipset for CDMA TIA/EIA-95 and AMPS applications

Authors :: Trevor Robinson
D. Yates
S. Lloyd
M. Reddy
P. Piriyapoksombut
B. Agamral
K. Rampmeier
Source :: 2000 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium Digest of Papers (Cat. No.00CH37096).
Publication Year :: 2002
Publisher :: IEEE, 2002.
Abstract: In this paper, a two device chip-set integrating the RF transceiver front-end function for the dual-band, dual-mode CDMA/AMPS cellular telephone standard TIA/EIA-98 is described. Fabricated in a double polysilicon, 25 GHz f/sub T/, silicon bipolar process, the transceiver achieves a total power dissipation of less than 480 mW at 3 V with 9 dBm transmitter power.

Subjects :: Engineering
Chipset
business.industry
Code division multiple access
Low-power electronics
Transmitter
Electrical engineering
Electronic engineering
Cellular network
Multi-band device
Transceiver
business
Power (physics)

Database :: OpenAIRE
Journal :: 2000 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium Digest of Papers (Cat. No.00CH37096)
Accession number :: edsair.doi.dedup.....49f18edb3aaae4999f2dc25eb0f84f5a
Full Text :: https://doi.org/10.1109/rfic.2000.854459

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