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One Bad Apple Spoils the Barrel: Understanding the Security Risks Introduced by Third-Party Components in IoT Firmware

Authors :
Binbin Zhao
Shouling Ji
Jiacheng Xu
Yuan Tian
Qiuyang Wei
Qinying Wang
Chenyang Lyu
Xuhong Zhang
Changting Lin
Jingzheng Wu
Raheem Beyah
Source :
IEEE Transactions on Dependable and Secure Computing. :1-18
Publication Year :
2023
Publisher :
Institute of Electrical and Electronics Engineers (IEEE), 2023.

Abstract

Currently, the development of IoT firmware heavily depends on third-party components (TPCs) to improve development efficiency. Nevertheless, TPCs are not secure, and the vulnerabilities in TPCs will influence the security of IoT firmware. Existing works pay less attention to the vulnerabilities caused by TPCs, and we still lack a comprehensive understanding of the security impact of TPC vulnerability against firmware. To fill in the knowledge gap, we design and implement FirmSec, which leverages syntactical features and control-flow graph features to detect the TPCs in firmware, and then recognizes the corresponding vulnerabilities. Based on FirmSec, we present the first large-scale analysis of the security risks raised by TPCs on $34,136$ firmware images. We successfully detect 584 TPCs and identify 128,757 vulnerabilities caused by 429 CVEs. Our in-depth analysis reveals the diversity of security risks in firmware and discovers some well-known vulnerabilities are still rooted in firmware. Besides, we explore the geographical distribution of vulnerable devices and confirm that the security situation of devices in different regions varies. Our analysis also indicates that vulnerabilities caused by TPCs in firmware keep growing with the boom of the IoT ecosystem. Further analysis shows 2,478 commercial firmware images have potentially violated GPL/AGPL licensing terms.

Details

ISSN :
21609209 and 15455971
Database :
OpenAIRE
Journal :
IEEE Transactions on Dependable and Secure Computing
Accession number :
edsair.doi.dedup.....52ec607ad3a2ed5ded8b4bf8b49784e0
Full Text :
https://doi.org/10.1109/tdsc.2023.3279846