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Failure Analysis of Aluminum Wire Bonds in Automotive Pressure Sensors in Thermal Shock Environments
- Source :
- IEEE Access, Vol 9, Pp 109548-109557 (2021)
- Publication Year :
- 2021
- Publisher :
- Institute of Electrical and Electronics Engineers (IEEE), 2021.
-
Abstract
- Wire bonding remains one of the most widely adopted interconnection techniques in the field of electronic packaging. At present, the most effective way to ensure a long life and high reliability of wire bonds is to improve the bonding quality. In this study, both experiments and finite element analysis (FEA) were employed to develop a fundamental understanding of wire bond degradation. Sensors with two protective silicone gels were loaded with the same thermal shock at a temperature ranging from $- 40^{\circ }\text{C}$ to 125°C, and the switching time was shorter than 10 s. The number of thermal shock cycles for the aluminum wire covered with transparent silicone reached 1200, but the maximum number of cycles for the other wire only reached 454. The experimental results indicated that the chosen transparent silicone performed better than did the black silicone originally selected, which was also verified by the simulation results. In addition, bond pull and shear tests were performed. The results revealed no degradation of either the Ag-Al or Ni-Al bonding joints under thermal loading. In summary, the root cause of failure was found to be improper protection silicone application, which, as often ignored in analysis, accelerated thermal fatigue of the aluminum wires. An explanation of the observed trend and a recommended aluminum wire bonding method were also provided.
- Subjects :
- Thermal shock
Interconnection
Wire bonding
reliability
Materials science
General Computer Science
General Engineering
Electronic packaging
chemistry.chemical_element
Silicone Gels
Finite element method
TK1-9971
chemistry.chemical_compound
Silicone
chemistry
Aluminium
finite element analysis (FEA)
General Materials Science
pressure sensor
Electrical engineering. Electronics. Nuclear engineering
Composite material
Subjects
Details
- ISSN :
- 21693536
- Volume :
- 9
- Database :
- OpenAIRE
- Journal :
- IEEE Access
- Accession number :
- edsair.doi.dedup.....57e5c3217a7ce633df617252cbe8bc2f