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Opportunities and challenges brought by 3D-sequential integration
- Source :
- 2021 IEEE International Interconnect Technology Conference (IITC), 2021 IEEE International Interconnect Technology Conference (IITC), Jul 2021, Kyoto, France. pp.1-1, ⟨10.1109/IITC51362.2021.9537356⟩
- Publication Year :
- 2021
- Publisher :
- HAL CCSD, 2021.
-
Abstract
- The aim of this paper is to present the 3D-sequential integration and its main prospective application sectors. The presentation will also give a synoptic view of all the key enabling process steps required to build high performance Si CMOS integrated by 3D-sequential with thermal budget preserving the integrity of active devices and interconnects and will sketch a status and prospect on current low temperature device performance.
- Subjects :
- Presentation
Reliability (semiconductor)
Materials science
CMOS
Process (engineering)
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Key (cryptography)
Systems engineering
[SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics
Active devices
Sketch
ComputingMilieux_MISCELLANEOUS
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Subjects
Details
- Language :
- English
- Database :
- OpenAIRE
- Journal :
- 2021 IEEE International Interconnect Technology Conference (IITC), 2021 IEEE International Interconnect Technology Conference (IITC), Jul 2021, Kyoto, France. pp.1-1, ⟨10.1109/IITC51362.2021.9537356⟩
- Accession number :
- edsair.doi.dedup.....5a896dcadaa6b8a425398da1a162204f