Characterization of Silicon Carbon Nitride for Low Temperature Wafer-to-Wafer Direct Bonding

MLA

Serena Iacovo, et al. “Characterization of Silicon Carbon Nitride for Low Temperature Wafer-to-Wafer Direct Bonding.” ECS Transactions, vol. 98, Sept. 2020, pp. 21–31. EBSCOhost, https://doi.org/10.1149/09804.0021ecst.

APA

Serena Iacovo, Erik Sleeckx, Gerald Beyer, Stefan De Gendt, Eric Beyne, Fumihiro Inoue, Fuya Nagano, & Alain Phommahaxay. (2020). Characterization of Silicon Carbon Nitride for Low Temperature Wafer-to-Wafer Direct Bonding. ECS Transactions, 98, 21–31. https://doi.org/10.1149/09804.0021ecst

Chicago

Serena Iacovo, Erik Sleeckx, Gerald Beyer, Stefan De Gendt, Eric Beyne, Fumihiro Inoue, Fuya Nagano, and Alain Phommahaxay. 2020. “Characterization of Silicon Carbon Nitride for Low Temperature Wafer-to-Wafer Direct Bonding.” ECS Transactions 98 (September): 21–31. doi:10.1149/09804.0021ecst.