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The impact of point defects in n-type GaN layers on thermal decomposition of InGaN/GaN QWs
- Source :
- Scientific Reports, Vol 11, Iss 1, Pp 1-11 (2021), Scientific Reports
- Publication Year :
- 2021
- Publisher :
- Nature Portfolio, 2021.
-
Abstract
- The aim of this paper is to give an experimental evidence that point defects (most probably gallium vacancies) induce decomposition of InGaN quantum wells (QWs) at high temperatures. In the experiment performed, we implanted GaN:Si/sapphire substrates with helium ions in order to introduce a high density of point defects. Then, we grew InGaN QWs on such substrates at temperature of 730 °C, what caused elimination of most (but not all) of the implantation-induced point defects expanding the crystal lattice. The InGaN QWs were almost identical to those grown on unimplanted GaN substrates. In the next step of the experiment, we annealed samples grown on unimplanted and implanted GaN at temperatures of 900 °C, 920 °C and 940 °C for half an hour. The samples were examined using Photoluminescence, X-ray Diffraction and Transmission Electron Microscopy. We found out that the decomposition of InGaN QWs started at lower temperatures for the samples grown on the implanted GaN substrates what provides a strong experimental support that point defects play important role in InGaN decomposition at high temperatures.
- Subjects :
- Materials for devices
Photoluminescence
Materials science
Science
chemistry.chemical_element
02 engineering and technology
Crystal structure
01 natural sciences
Article
0103 physical sciences
Gallium
Condensed-matter physics
Quantum well
010302 applied physics
Multidisciplinary
business.industry
Thermal decomposition
021001 nanoscience & nanotechnology
Crystallographic defect
chemistry
Transmission electron microscopy
Sapphire
Optoelectronics
Medicine
0210 nano-technology
business
Subjects
Details
- Language :
- English
- ISSN :
- 20452322
- Volume :
- 11
- Issue :
- 1
- Database :
- OpenAIRE
- Journal :
- Scientific Reports
- Accession number :
- edsair.doi.dedup.....6f7777e5b1efd91ce8353c0638ac93b2