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Soft solution processing: concept and realization of direct fabrication of shaped ceramics (nano-crystals, whiskers, films, and/or patterns) in solutions without post-firing

Authors :
Masahiro Yoshimura
Source :
Journal of Materials Science. 41:1299-1306
Publication Year :
2006
Publisher :
Springer Science and Business Media LLC, 2006.

Abstract

Based upon thermodynamic consideration for materials cycling and processing on the earth, where environmental and energetical problems have been seriously considered, we can conclude that solution processing using aqueous solutions should be the most important processing for advanced materials. According to the concept, we are proposing Soft Solution Processing (SSP) where advanced ceramics also must be preferably fabricated in solution(s) directly into desired composition, structure, shape, size, location, orientation, etc., in a closed system. This is contrasting to conventional processings where advanced ceramics have been fabricated from solids, liquids, and/or gases including atoms and/or ions in vacuum by sophisticated processes using high temperatures, high pressures, expensive precursors, and equipments. In most those processes, exhausted materials and heats have never cycled but just discarded into the environment. We have succeeded to prepare nanocrystals of ZrO2, HfO2, HAp, BaTiO3, CeO2/ZrO2, LiCoO2, CdS, etc., whiskers of HAp, and films of BaTiO3, SrTiO3, CaWO4, BaMoO4, YVO4, LiCoO2, LiNiO2, ZnFe2O4, etc., in solutions at low temperatures of RT-150°C. Recently, the fabrication of patterned films for LiCoO2, PbS, CdS, BaTiO3, SrTiO3, etc., have also been succeeded in/from solutions at the low temperatures. Those “Direct Patterning of Ceramics” should be soft in comparison with conventional ceramic patterning where multi-steps like firing, sintering, masking, etching, etc., are required even after synthesizing ceramic powders.

Details

ISSN :
15734803 and 00222461
Volume :
41
Database :
OpenAIRE
Journal :
Journal of Materials Science
Accession number :
edsair.doi.dedup.....7adc1b17fc07d9ba598883d34f3cb18c
Full Text :
https://doi.org/10.1007/s10853-006-7262-8