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Impact of Polysorbate 80 Grade on the Interfacial Properties and Interfacial Stress Induced Subvisible Particle Formation in Monoclonal Antibodies

Authors :
Coleman Vaclaw
Neal Whitaker
Duohai Pan
Zhihua Liu
Mehrnaz Khossravi
Kimberly Merritt
Mark S. Bolgar
David B. Volkin
Gokhale Madhushree Yeshwant
Dilbir S. Bindra
Valerie Pringle
Prajnaparamita Dhar
Thiago C. Carvalho
Maria O. Ogunyankin
Source :
Journal of pharmaceutical sciences. 110(2)
Publication Year :
2020

Abstract

Polysorbate 80 is a nonionic surfactant that is added to therapeutic protein formulations to mitigate protein particle formation when subjected to various mechanical stresses. Variations in the PS80 grade has recently sparked questions surrounding the effect of oleic acid content (OAC) on surfactant's ability to mitigate interface-induced protein particle formation when stressed. In this work, a Langmuir trough was used to apply interfacial dilatational stress to two IgG molecules (mAb1 and mAb2) in formulations containing Chinese pharmacopeia (CP) and multicompendial (MC) grades of PS80. The interfacial properties of these mAb formulations, with and without interfacial dilatational stresses, were correlated with subvisible particle count and particle size/morphology distributions as measured by Micro-flow imaging (MFI). Overall, differences in interfacial properties correlated well with protein particle formation for both molecules in the two PS80 formulations. Further, the impact of grade of PS80 on the interfacial properties and interfacial stress-induced protein particle formation depends on the adsorption kinetics of the IgG molecules as well as the concentration of the surfactant used. This study demonstrates that measuring the interfacial properties of mAb formulations can be a useful tool to predict interfacial stress induced protein particle formation in the presence of different excipients of varying quality.

Details

ISSN :
15206017
Volume :
110
Issue :
2
Database :
OpenAIRE
Journal :
Journal of pharmaceutical sciences
Accession number :
edsair.doi.dedup.....907605d4abc31c5eee9409fc416b7566