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Antenna-in-package design and module integration for millimeter-wave communication and 5G

Authors :
Duixian Liu
Christian W. Baks
Xiaoxiong Gu
Alberto Valdes-Garcia
Bodhisatwa Sadhu
Source :
VLSI-DAT
Publication Year :
2018
Publisher :
IEEE, 2018.

Abstract

Co-design and integration of RFIC, package, and antennas are critical to enable 5G wireless communications and is particularly challenging at mmWave frequencies. This paper reviews two different aspects of mmWave antenna module packaging and integration for base station and user equipment applications, respectively. We first present the challenges, implementation, and characterization of a 28­GHz phased-array module with 64 dual polarized antennas for 5G base station applications. Next, we describe a compact, low-power, 60-GHz switched-beam transceiver module suitable for handset integration incorporating 4 antennas that supports both normal and end-fire directions for a wide link spatial coverage.

Details

Database :
OpenAIRE
Journal :
2018 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA)
Accession number :
edsair.doi.dedup.....9a2c32da849a8fac765cf48b164747ec
Full Text :
https://doi.org/10.1109/vlsi-tsa.2018.8403808