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Multiphase CuOz–CeO2−δ thin films by pulsed laser deposition technique: experimental texture evolutions and kinetics modeling

Authors :
Jan Kusiński
Magdalena Klimczak-Chmielowska
Sylvie Villain
Agnieszka Kopia
Jean-Raymond Gavarri
Christine Leroux
Radoslaw Chmielowski
Institut des Matériaux, de Microélectronique et des Nanosciences de Provence (IM2NP)
Université de Toulon (UTLN)-Centre National de la Recherche Scientifique (CNRS)-Aix Marseille Université (AMU)
Aix Marseille Université (AMU)-Université de Toulon (UTLN)-Centre National de la Recherche Scientifique (CNRS)
Source :
Thin Solid Films, Thin Solid Films, Elsevier, 2004, 458 (1-2), pp.98-107. ⟨10.1016/j.tsf.2003.11.312⟩, Thin Solid Films, 2004, 458 (1-2), pp.98-107. ⟨10.1016/j.tsf.2003.11.312⟩
Publication Year :
2004
Publisher :
Elsevier BV, 2004.

Abstract

CeO 2 thin films for gas sensors doped with Cu were elaborated by pulsed-laser deposition (PLD) technique from Cu–CeO 2 targets. The films were deposited on oriented Si substrates for various deposition times. Scanning electron microscopy analyses evidenced correlations between crystalline texture of thin films, copper atom fractions and deposition times. A statistical study of grain sizes and texture allows evaluation of growth rates. From X-ray diffraction analyses, it was clearly established that texture effects are continuously modified as the Cu atom fraction increases: preferred (111) orientations of CeO 2 crystals change into (200) orientations. Such morphological effects might be involved by the presence of a CuO z phase, formed during the condensation process and peculiarly associated with the laser deposition technique. A texture parameter R corresponding to the volume ratio of oriented phases is defined. A first modeling of this texture parameter as a function of Cu composition x and deposition time t is proposed.

Details

ISSN :
00406090
Volume :
458
Database :
OpenAIRE
Journal :
Thin Solid Films
Accession number :
edsair.doi.dedup.....a2e213a9dc58e899048617b3ec43d7c6
Full Text :
https://doi.org/10.1016/j.tsf.2003.11.312