Modifications of the wetting characteristics of electrodeposited porous copper by controlling the plating parameters and storage conditions

The wetting behavior of copper is important for many engineering applications. The present study demonstrates a method to modify the wetting characteristics of copper surfaces by developing porous structures via the promotion of hydrogen bubbles and rapid and nonuniform growth of the deposits. The porous copper deposits are fabricated with various controlled plating parameters, and subsequently stored in different conditions, including air, water, and saline solution, to assess the possible influence of the storage conditions on the wetting behavior. The study shows that the wetting angles can be tailored by electrodeposition parameters, namely, plating bath formulation and applied current density, which influence the morphology of the porous structure. The storage conditions are found to largely affect the wetting behavior, owing to their influence on surface morphology and surface chemistry. Hydrophobic and hydrophilic surface characteristics are developed in the copper deposits stored in air and in the saline solution, respectively.