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Design and Development of a Fully Automated Assembly Solution for Optical Backplane Interconnection Circuits

Authors :
Serena Ruggeri
Vito Basile
Gianmauro Fontana
Irene Fassi
Source :
ASME 2015 International Design Engineering Technical Conferences & Computers and Information in Engineering Conference IDETC/CIE 2015, pp. V004T09A039, Boston, Massachusetts, USA, 02/08/2015, info:cnr-pdr/source/autori:S. Ruggeri, V. Basile, G. Fontana, I. Fassi/congresso_nome:ASME 2015 International Design Engineering Technical Conferences & Computers and Information in Engineering Conference IDETC%2FCIE 2015/congresso_luogo:Boston, Massachusetts, USA/congresso_data:02%2F08%2F2015/anno:2015/pagina_da:V004T09A039/pagina_a:/intervallo_pagine:V004T09A039
Publication Year :
2015
Publisher :
American Society of Mechanical Engineers, 2015.

Abstract

The paper presents the design and development of a new robotized assembly system of optical backplanes in high-capacity ICT (Information and Communication Technology) apparatus, mainly used for switching stations and distribution networks. The optical backplane solution consists of several optical fiber ribbons positioned on a planar backplane according to an innovative and optimized full-mesh layout where the overall optical interconnection is partialized into a plurality of different independent sub-circuits. Each optical interconnection sub-circuit consists of optical fiber ribbons with standardized optical and mechanical interfaces and customized components that have to be carefully and precisely assembled in order to achieve connections with low optical power losses. The paper describes the method and the main devices and tools conceived for the automatic assembly of optical interconnection sub-circuits, highlighting the critical aspects and the proposed solutions towards the automatized assembly of the whole optical backplane.Copyright © 2015 by ASME

Details

Database :
OpenAIRE
Journal :
Volume 4: 20th Design for Manufacturing and the Life Cycle Conference; 9th International Conference on Micro- and Nanosystems
Accession number :
edsair.doi.dedup.....bf1f17a6c213130c467413210cb9081f
Full Text :
https://doi.org/10.1115/detc2015-47095