Test methods and processes in manufacturing chain of photonic integrated circuits

Access to fabrication of photonic integrated circuits is enabled via multi-project wafer runs offered by foundries. Such services open a path for proof-of-concept demonstrators and advanced prototypes. However, the technology processes behind those services need extensive developments in order to be scalable and suitable for volume production. Those developments are in a vast part related to test, assembly and packaging across the full PIC manufacturing chain. Standardization and automation of the test methods and equipment is essential for better statistical process control and scalability. When implemented, these will allow for early known-good-die identification, optimization of fabrication process window, improved yield and volume production.The challenges related to PIC testing will be discussed and current developments in our labs towards standardization and automation of test methods from a design phase to system level functional module evaluation will be presented.