Adhesive-Free Bonding of Monolithic Sapphire for Pressure Sensing in Extreme Environments

This paper presents a monolithic sapphire pressure sensor that is constructed from two commercially available sapphire wafers through a combination of reactive-ion etching and wafer bonding. A Fabry&ndash
Perot (FP) cavity is sealed fully between the adhesive-free bonded sapphire wafers and thus acts as a pressure transducer. A combination of standard silica fiber, bonded sapphire wafers and free-space optics is proposed to couple the optical signal to the FP cavity of the sensor. The pressure in the FP cavity is measured by applying both white-light interferometry and diaphragm deflection theory over a range of 0.03 to 3.45 MPa at room temperature. With an all-sapphire configuration, the adhesive-free bonded sapphire sensor is expected to be suitable for in-situ pressure measurements in extreme harsh environments.