Back to Search
Start Over
Characterization and impact of reduced copper plating overburden on 45 nm interconnect performances
- Source :
- Microelectronic Engineering, Microelectronic Engineering, Elsevier, 2010, 87 (3), pp.421-425. ⟨10.1016/j.mee.2009.07.002⟩, Microelectronic Engineering, 2010, 87 (3), pp.421-425. ⟨10.1016/j.mee.2009.07.002⟩
- Publication Year :
- 2010
- Publisher :
- HAL CCSD, 2010.
-
Abstract
- During first metal level interconnects fabrication, a controlled modification of the electro-deposited copper over-deposition (overburden) is performed using a partial chemical-mechanical polishing (CMP) step. Next, copper microstructure is stabilized with a short duration hot-plate anneal. Overburden is then removed during CMP end-of-step. Ionic microscopy and EBSD observations of overburden thickness reduction reveal that copper grain growth occurs differently, according to patterned geometries and with a strong texture, as observed in modified films. Reduction of overburden thickness also reveals the capacity of anneal temperature to impact electrical performances. Reliability is impacted for thinnest wires.
- Subjects :
- Materials science
Annealing (metallurgy)
Copper interconnect
Polishing
chemistry.chemical_element
02 engineering and technology
01 natural sciences
Chemical-mechanical planarization
0103 physical sciences
Copper plating
Electrical and Electronic Engineering
ComputingMilieux_MISCELLANEOUS
010302 applied physics
Metallurgy
[CHIM.MATE]Chemical Sciences/Material chemistry
021001 nanoscience & nanotechnology
Condensed Matter Physics
Copper
Atomic and Molecular Physics, and Optics
Surfaces, Coatings and Films
Electronic, Optical and Magnetic Materials
Grain growth
Overburden
chemistry
13. Climate action
0210 nano-technology
Subjects
Details
- Language :
- English
- ISSN :
- 01679317 and 18735568
- Database :
- OpenAIRE
- Journal :
- Microelectronic Engineering, Microelectronic Engineering, Elsevier, 2010, 87 (3), pp.421-425. ⟨10.1016/j.mee.2009.07.002⟩, Microelectronic Engineering, 2010, 87 (3), pp.421-425. ⟨10.1016/j.mee.2009.07.002⟩
- Accession number :
- edsair.doi.dedup.....cebdc7518e6855fef2093e47d1a5a42e
- Full Text :
- https://doi.org/10.1016/j.mee.2009.07.002⟩