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High efficiency direct liquid jet impingement cooling of high power devices using a 3D-shaped polymer cooler
- Publication Year :
- 2017
- Publisher :
- San Francisco, 2017.
-
Abstract
- © 2017 IEEE. A novel 3D-shaped polymer multi-jet impingement cooler based on low cost fabrication techniques is introduced for high performance applications. This paper presents the modeling study, design, fabrication, experimental characterization and benchmarking of this cooling concept, showing a very good thermal performance with low required pumping power. ispartof: pages:733-736 ispartof: 2017 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM) pages:733-736 ispartof: 63rd IEEE Annual International Electron Devices Meeting (IEDM) location:San Francisco: CA date:2 Dec - 6 Dec 2017 status: published
- Subjects :
- 010302 applied physics
chemistry.chemical_classification
Fabrication
Materials science
020209 energy
Physics::Optics
chemistry.chemical_element
Mechanical engineering
02 engineering and technology
Polymer
01 natural sciences
Characterization (materials science)
Power (physics)
chemistry
Machining
0103 physical sciences
Thermal
Hardware_INTEGRATEDCIRCUITS
0202 electrical engineering, electronic engineering, information engineering
Power semiconductor device
Tin
Subjects
Details
- Language :
- English
- Database :
- OpenAIRE
- Accession number :
- edsair.doi.dedup.....d7f61e30890d12d116c5eb06194ee4f2