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Fabrication and ink-jet patterning of copper nanoparticles with improved dispersion stability
- Source :
- Journal of nanoscience and nanotechnology. 10(5)
- Publication Year :
- 2010
-
Abstract
- Copper (Cu) nanoparticles as the metal nanoparticles in the conductive ink were synthesized using electrochemical reaction. This method is characterized as the synthesis process without any metal salts and the post-treatment of washing and drying. It means that it does not need to consider about oxidized and agglomerated metal nanoparticles during the extra treatments. The Cu nanoparticles were synthesized in the various conditions of electrolyte to investigate the mechanism of the synthesis reaction of Cu nanoparticles. And also, the synthesized Cu nanoparticles were controlled the dispersion stability with the addition of dispersion agent such as PVP and Dextran. Finally, it was achieved the ink-jet printed Cu patterns using the synthesized Cu nanoparticles, and examined the morphology of the patterns.
- Subjects :
- Materials science
Fabrication
Biomedical Engineering
Nanoparticle
chemistry.chemical_element
Bioengineering
General Chemistry
Electrolyte
Condensed Matter Physics
Electrochemistry
Copper
Chemical engineering
chemistry
Dispersion stability
Conductive ink
General Materials Science
Dispersion (chemistry)
Subjects
Details
- ISSN :
- 15334880
- Volume :
- 10
- Issue :
- 5
- Database :
- OpenAIRE
- Journal :
- Journal of nanoscience and nanotechnology
- Accession number :
- edsair.doi.dedup.....d8ca6769bf962f1fc4e26e826f6236d7