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Atoms-to-circuits simulation investigation of CNT interconnects for next generation CMOS technology

Authors :
Jie Liang
Andrew Pender
Flamen Asenov
Vihar P. Georgiev
Toufik Sadi
Campbell Millar
Aida Todri-Sanial
Jaehyun Lee
D. Reid
Asen Asenov
Liping Wang
Salvatore Maria Amoroso
James Watt School of Engineering [Univ Glasgow]
University of Glasgow
Smart Integrated Electronic Systems (SmartIES)
Laboratoire d'Informatique de Robotique et de Microélectronique de Montpellier (LIRMM)
Centre National de la Recherche Scientifique (CNRS)-Université de Montpellier (UM)-Centre National de la Recherche Scientifique (CNRS)-Université de Montpellier (UM)
Synopsys Inc.
European Project: 688612,H2020,H2020-ICT-2015,CONNECT(2016)
Université de Montpellier (UM)-Centre National de la Recherche Scientifique (CNRS)-Université de Montpellier (UM)-Centre National de la Recherche Scientifique (CNRS)
Source :
2017 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), SISPAD 2017: International Conference on Simulation of Semiconductor Processes and Devices, International Conference on Simulation of Semiconductor Processes and Devices, SISPAD: Simulation of Semiconductor Processes and Devices, SISPAD: Simulation of Semiconductor Processes and Devices, Sep 2017, Kamakura, Japan. pp.153-156, ⟨10.23919/SISPAD.2017.8085287⟩
Publisher :
IEEE

Abstract

In this study, we suggest a hierarchical model to\ud investigate the electrical performance of carbon nanotube (CNT)-\ud based interconnects. From the density functional theory, we have\ud obtained important physical parameters, which are used in TCAD\ud simulators to obtain the RC netlists. We then use these RC netlists\ud for the circuit-level simulations to optimize interconnect design in\ud VLSI. Also, we have compared various CNT-based interconnects\ud such as single-walled CNTs, multi-walled CNTs, doped CNTs, and\ud Cu-CNT composites in terms of conductivity, ring oscillator delay,\ud and propagation time delay.

Details

Language :
English
ISBN :
978-4-86348-611-9
978-4-86348-610-2
ISBNs :
9784863486119 and 9784863486102
Database :
OpenAIRE
Journal :
2017 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), SISPAD 2017: International Conference on Simulation of Semiconductor Processes and Devices, International Conference on Simulation of Semiconductor Processes and Devices, SISPAD: Simulation of Semiconductor Processes and Devices, SISPAD: Simulation of Semiconductor Processes and Devices, Sep 2017, Kamakura, Japan. pp.153-156, ⟨10.23919/SISPAD.2017.8085287⟩
Accession number :
edsair.doi.dedup.....d965a71485a3004d626f9e34ffe530ba
Full Text :
https://doi.org/10.23919/sispad.2017.8085287