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Atoms-to-circuits simulation investigation of CNT interconnects for next generation CMOS technology
- Source :
- 2017 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), SISPAD 2017: International Conference on Simulation of Semiconductor Processes and Devices, International Conference on Simulation of Semiconductor Processes and Devices, SISPAD: Simulation of Semiconductor Processes and Devices, SISPAD: Simulation of Semiconductor Processes and Devices, Sep 2017, Kamakura, Japan. pp.153-156, ⟨10.23919/SISPAD.2017.8085287⟩
- Publisher :
- IEEE
-
Abstract
- In this study, we suggest a hierarchical model to\ud investigate the electrical performance of carbon nanotube (CNT)-\ud based interconnects. From the density functional theory, we have\ud obtained important physical parameters, which are used in TCAD\ud simulators to obtain the RC netlists. We then use these RC netlists\ud for the circuit-level simulations to optimize interconnect design in\ud VLSI. Also, we have compared various CNT-based interconnects\ud such as single-walled CNTs, multi-walled CNTs, doped CNTs, and\ud Cu-CNT composites in terms of conductivity, ring oscillator delay,\ud and propagation time delay.
- Subjects :
- Propagation time
Materials science
Interconnects
Nanotechnology
02 engineering and technology
Ring oscillator
Carbon nanotube
Hardware_PERFORMANCEANDRELIABILITY
01 natural sciences
law.invention
[SPI]Engineering Sciences [physics]
Computer Science::Hardware Architecture
Condensed Matter::Materials Science
Circuit simulation
law
Hierarchical models
0103 physical sciences
Hardware_INTEGRATEDCIRCUITS
[SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics
ta217
Electronic circuit
ta113
010302 applied physics
Very-large-scale integration
Cu-CNT composites
Interconnection
business.industry
021001 nanoscience & nanotechnology
Density Functional Theory (DFT)
CMOS
Optoelectronics
Carbon nanotubes (CNTs)
0210 nano-technology
business
Science, technology and society
Hardware_LOGICDESIGN
Subjects
Details
- Language :
- English
- ISBN :
- 978-4-86348-611-9
978-4-86348-610-2 - ISBNs :
- 9784863486119 and 9784863486102
- Database :
- OpenAIRE
- Journal :
- 2017 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), SISPAD 2017: International Conference on Simulation of Semiconductor Processes and Devices, International Conference on Simulation of Semiconductor Processes and Devices, SISPAD: Simulation of Semiconductor Processes and Devices, SISPAD: Simulation of Semiconductor Processes and Devices, Sep 2017, Kamakura, Japan. pp.153-156, ⟨10.23919/SISPAD.2017.8085287⟩
- Accession number :
- edsair.doi.dedup.....d965a71485a3004d626f9e34ffe530ba
- Full Text :
- https://doi.org/10.23919/sispad.2017.8085287