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Heat development at the microscale in ceramic components - thermography and complementary tools

Authors :
Sören Röhrig
Michael Hofstätter
Raul Bermejo
Isabella Petschenig
Franz Aldrian
Peter Supancic
Robert Danzer
Source :
Scopus-Elsevier
Publication Year :
2015
Publisher :
IMAPS - International Microelectronics Assembly and Packaging Society, 2015.

Abstract

In many ceramic components for electric applications, small defects in the microstructure may cause an anomalous current flow. Especially in components exhibiting nonlinear electro-thermal properties, such as varistors, PTC or NTC resistors, inhomogeneities lead to high concentrations of current and localized heat generation due to positive feedback effects. While the integral behavior of those components is often nearly not affected by these defects, the local load at these hot spot regions is considerably high and can even lead to the complete failure of the device. In this work micro-analytical tools are combined to identify the location and type of defects which may cause leakage currents, overheat or other reasons for inhomogeneous current distributions in functional ceramic components. Lock-in thermography is used to localize dominating current paths. This is even possible if the heat sources are in the micrometer range or less. Additionally, micro-sectioning techniques (e.g. Focus Ion Beam) are utilized to expose such regions to investigate features of the microstructure and causes for the enhanced current flows. Examples are shown in PTC resistor components as well as in LTCC based modules.

Details

ISSN :
23804491
Volume :
2015
Database :
OpenAIRE
Journal :
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
Accession number :
edsair.doi.dedup.....dd0bba86cec60a704bf32facbd905582
Full Text :
https://doi.org/10.4071/cicmt-tha21