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High Power CMUTs: design and experimental verification
- Source :
- IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control, IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control
- Publication Year :
- 2012
- Publisher :
- IEEE, 2012.
-
Abstract
- Capacitive micromachined ultrasonic transducers (CMUTs) have great potential to compete with piezoelectric transducers in high-power applications. As the output pressures increase, nonlinearity of CMUT must be reconsidered and optimization is required to reduce harmonic distortions. In this paper, we describe a design approach in which uncollapsed CMUT array elements are sized so as to operate at the maximum radiation impedance and have gap heights such that the generated electrostatic force can sustain a plate displacement with full swing at the given drive amplitude. The proposed design enables high output pressures and low harmonic distortions at the output. An equivalent circuit model of the array is used that accurately simulates the uncollapsed mode of operation. The model facilities the design of CMUT parameters for high-pressure output, without the intensive need for computationally involved FEM tools. The optimized design requires a relatively thick plate compared with a conventional CMUT plate. Thus, we used a silicon wafer as the CMUT plate. The fabrication process involves an anodic bonding process for bonding the silicon plate with the glass substrate. To eliminate the bias voltage, which may cause charging problems, the CMUT array is driven with large continuous wave signals at half of the resonant frequency. The fabricated arrays are tested in an oil tank by applying a 125-V peak 5-cycle burst sinusoidal signal at 1.44 MHz. The applied voltage is increased until the plate is about to touch the bottom electrode to get the maximum peak displacement. The observed pressure is about 1.8 MPa with -28 dBc second harmonic at the surface of the array. © 2012 IEEE.
- Subjects :
- Bottom electrodes
Engineering
Acoustics and Ultrasonics
Array elements
Capacitive sensing
Ultrasonic transducers
Experimental verification
Oil tanks
Receive performance
Signal
Sinusoidal signals
Gap height
equipment design
Circuit
Fabrication process
Electric Impedance
Improved transmit
Instrumentation
Non-Linearity
Operation
Ultrasonography
instrumentation
Dual-electrode structure
Radiation impedance
Thick plate
electronics
theoretical model
article
Electrical engineering
Feasibility
Equipment Design
Design approaches
transducer
High power applications
High output
Second harmonics
Harmonic
Peak displacement
Micromachined ultrasonic transducers
Optimization
Anodic bonding process
Design
Acoustics
Transducers
Harmonic distortion
Natural frequencies
Silicon wafers
Capacitive micromachined ultrasonic transducers
computer simulation
Computer Simulation
Continuous-wave signals
Electrical and Electronic Engineering
Electrical impedance
Equivalent circuit model
Membranes
Substrates
Full-swing
business.industry
Capacitive micromachined ultrasonic transducer
Silicon plates
Array
echography
Models, Theoretical
Optimized designs
Electronics, Medical
Glass substrates
Mode of operations
Anodic bonding
impedance
Equivalent circuit
business
Applied voltages
Fabricated arrays
High-power
Voltage
Subjects
Details
- Language :
- English
- Database :
- OpenAIRE
- Journal :
- IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control, IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control
- Accession number :
- edsair.doi.dedup.....e4b4974ef1e4f2a6c3144e5020dd5c8d