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Fringing Field Capacitive Smart Sensor Based on PCB Technology for Measuring Water Content in Paper Pulp
- Source :
- Web of Science, Repositório Institucional da UNESP, Universidade Estadual Paulista (UNESP), instacron:UNESP, Journal of Sensors, Vol 2020 (2020)
- Publication Year :
- 2020
- Publisher :
- Hindawi Ltd, 2020.
-
Abstract
- Made available in DSpace on 2020-12-10T19:54:25Z (GMT). No. of bitstreams: 0 Previous issue date: 2020-03-04 Coordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES) We present a capacitive smart sensor based on printed circuit board (PCB) technology to measure the amount of water content in a paper pulp at the wet end of a paper machine. The developed sensor incorporates in the same PCB the signal processing circuits. It is a handheld portable device, and its output is sent to the reading equipment using a Bluetooth wireless connection, providing to the sensor's operator ease of mobility around the wet end of a paper machine. The prototype was tested in a laboratory, using a wire mesh to emulate the end of a paper machine, and we were able to measure and easily detect when it reaches the water content in the range of 90% to 92%, as required in the paper fabrication process. Standard deviation of the capacitance measurements at various moisture levels is four orders of magnitude smaller than the mean. The smart sensor was tested in the 20 degrees C to 40 degrees C temperature range, in a paper pulp with a gravimetric water content of 91%. Since the variation of capacitance with temperature is practically linear, we propose a simple linear compensation equation to correct the observed sensitivity with the temperature. To keep the signal processing circuits small, low cost, simple, and robust, a novel direct interface sensor to microcontroller circuit technique was used to make the capacitive measurement, allowing for measuring small capacitance deviations without high-frequency oscillators. It was shown that it is possible to integrate the signal processing circuits in the top layer of the PCB interdigitated sensor without adding noise or degrading the performance of the capacitive sensor. Sao Paulo State Univ Julio de Mesquita Filho, Fac Sci & Engn, Tupa, SP, Brazil Parana Fed Univ Technol UTFPR, Cornelio Procopio, PR, Brazil FEEC UNICAMP, Dept Semicond Instrumentat & Photon, Campinas, SP, Brazil Uninove Campus Vergueiro, Sao Paulo, SP, Brazil Sao Paulo State Univ Julio de Mesquita Filho, Fac Sci & Engn, Tupa, SP, Brazil CAPES: 001
- Subjects :
- Fabrication
business.product_category
Article Subject
Computer science
Capacitive sensing
Hardware_PERFORMANCEANDRELIABILITY
02 engineering and technology
01 natural sciences
Capacitance
law.invention
Bluetooth
Printed circuit board
law
Hardware_INTEGRATEDCIRCUITS
0202 electrical engineering, electronic engineering, information engineering
T1-995
Electrical and Electronic Engineering
Instrumentation
Technology (General)
business.industry
020208 electrical & electronic engineering
010401 analytical chemistry
Electrical engineering
0104 chemical sciences
Microcontroller
Paper machine
Control and Systems Engineering
business
Mobile device
Subjects
Details
- Language :
- English
- Database :
- OpenAIRE
- Journal :
- Web of Science, Repositório Institucional da UNESP, Universidade Estadual Paulista (UNESP), instacron:UNESP, Journal of Sensors, Vol 2020 (2020)
- Accession number :
- edsair.doi.dedup.....fc5d896dcc0656181d5d3055484d8414