Back to Search
Start Over
Poly-Si/SiOx/c-Si passivating contact with 738 mV implied open circuit voltage fabricated by hot-wire chemical vapor deposition
- Source :
- Applied physics letters 114(15), 153901 (2019). doi:10.1063/1.5089650
- Publication Year :
- 2019
- Publisher :
- AIP Publishing, 2019.
-
Abstract
- Hot-wire chemical vapor deposition (HWCVD) was utilized to develop a fast and high quality a-Si:H thin film fabrication method for poly-Si/SiOx carrier selective passivating contacts targeting at n-type passivated emitter rear totally diffused crystalline silicon solar cells. The microstructure and hydrogen content of the a-Si:H thin films were analyzed by Fourier-transform infrared spectroscopy in order to understand the influence of film properties on passivation and conductivity. Dense layers were found to be beneficial for good passivation. On the other hand, blistering appeared as a-Si:H layers became more and more dense. However, by adjusting the SiH4 flow rate and the substrate heater temperature, blistering of a-Si:H could be avoided. A suitable process window was found and firing-stable implied open circuit voltage (iVoc) of up to 738 mV was achieved. In addition to high iVoc, a low contact resistivity of 0.034 Ω cm2 was also achieved. The deposition rate of the a-Si:H layers was 7 A/s by using HWCVD, which is one order of magnitude higher than the deposition rate reported using other deposition methods.Hot-wire chemical vapor deposition (HWCVD) was utilized to develop a fast and high quality a-Si:H thin film fabrication method for poly-Si/SiOx carrier selective passivating contacts targeting at n-type passivated emitter rear totally diffused crystalline silicon solar cells. The microstructure and hydrogen content of the a-Si:H thin films were analyzed by Fourier-transform infrared spectroscopy in order to understand the influence of film properties on passivation and conductivity. Dense layers were found to be beneficial for good passivation. On the other hand, blistering appeared as a-Si:H layers became more and more dense. However, by adjusting the SiH4 flow rate and the substrate heater temperature, blistering of a-Si:H could be avoided. A suitable process window was found and firing-stable implied open circuit voltage (iVoc) of up to 738 mV was achieved. In addition to high iVoc, a low c...
- Subjects :
- 010302 applied physics
Materials science
Physics and Astronomy (miscellaneous)
Passivation
Silicon
Open-circuit voltage
business.industry
chemistry.chemical_element
02 engineering and technology
Substrate (electronics)
Chemical vapor deposition
021001 nanoscience & nanotechnology
01 natural sciences
chemistry
0103 physical sciences
Deposition (phase transition)
Optoelectronics
ddc:530
Crystalline silicon
Thin film
0210 nano-technology
business
Subjects
Details
- ISSN :
- 10773118 and 00036951
- Volume :
- 114
- Database :
- OpenAIRE
- Journal :
- Applied Physics Letters
- Accession number :
- edsair.doi.dedup.....fcdbf37a7935ac5befac97b53b4ff0eb
- Full Text :
- https://doi.org/10.1063/1.5089650