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Experimental And Numerical Characterization Of PCB-Embedded Power Dies Using Solderless Pressed Metal Foam
- Source :
- 2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe), 2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe), Sep 2020, Lyon, France. pp.1-10, ⟨10.23919/EPE20ECCEEurope43536.2020.9215758⟩
- Publication Year :
- 2020
- Publisher :
- HAL CCSD, 2020.
-
Abstract
- A new process of embedding power die on PCB is presented which consists on removing wire bonding and solder and using only a pressed metal foam to connect the top and bottom sides of the die. First, the manufacturing process is described. Then the effective electrical, thermal and mechanical properties of the mixture made of the foam impregnated by resin insuring the contacts between die and PCB are identified experimentally and numerically. Finally, 3D FEM simulations are performed to estimate the electrical contacts resistances between foam and pads of the die within the package.
- Subjects :
- 010302 applied physics
Wire bonding
business.product_category
Materials science
[SPI.NRJ]Engineering Sciences [physics]/Electric power
02 engineering and technology
Metal foam
021001 nanoscience & nanotechnology
01 natural sciences
Electrical contacts
Characterization (materials science)
Power (physics)
[SPI]Engineering Sciences [physics]
Soldering
0103 physical sciences
Thermal
Die (manufacturing)
Composite material
0210 nano-technology
business
ComputingMilieux_MISCELLANEOUS
Subjects
Details
- Language :
- English
- Database :
- OpenAIRE
- Journal :
- 2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe), 2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe), Sep 2020, Lyon, France. pp.1-10, ⟨10.23919/EPE20ECCEEurope43536.2020.9215758⟩
- Accession number :
- edsair.doi.dedup.....feee8ed54839dee9a472e5f3de41c4a9