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Solid Liquid Interdiffusion Bonding for Micro Devices near Room Temperature

Authors :
Froemel, J.
Wiemer, M.
Tanaka, S.
Esashi, M.
Gessner, T.
Publica
Publication Year :
2013

Details

Language :
English
Database :
OpenAIRE
Accession number :
edsair.od.......610..a05db4819b136198caa868d9b7168b25

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