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Interfacial Thermal Conductance between Cu and Diamond with Interconnected W-W
- Source :
- ACS applied materialsinterfaces. 14(30)
- Publication Year :
- 2022
-
Abstract
- Manipulating the interfacial structure is vital to enhancing the interfacial thermal conductance (
Details
- ISSN :
- 19448252
- Volume :
- 14
- Issue :
- 30
- Database :
- OpenAIRE
- Journal :
- ACS applied materialsinterfaces
- Accession number :
- edsair.pmid..........16d2aed1f42fdfb85ea34cefe8d0108f