Cite
High thermal conductivity of bulk epoxy resin by bottom-up parallel-linking and strain: a molecular dynamics study
MLA
Li, Shouhang, et al. High Thermal Conductivity of Bulk Epoxy Resin by Bottom-up Parallel-Linking and Strain: A Molecular Dynamics Study. 2018. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsarx&AN=edsarx.1801.04391&authtype=sso&custid=ns315887.
APA
Li, S., Yu, X., Bao, H., & Yang, N. (2018). High thermal conductivity of bulk epoxy resin by bottom-up parallel-linking and strain: a molecular dynamics study.
Chicago
Li, Shouhang, Xiaoxiang Yu, Hua Bao, and Nuo Yang. 2018. “High Thermal Conductivity of Bulk Epoxy Resin by Bottom-up Parallel-Linking and Strain: A Molecular Dynamics Study.” http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edsarx&AN=edsarx.1801.04391&authtype=sso&custid=ns315887.