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Building Blocks of a Flip-Chip Integrated Superconducting Quantum Processor
- Source :
- Quantum Science and Technology, 7(3), 035018 (2022)
- Publication Year :
- 2021
-
Abstract
- We have integrated single and coupled superconducting transmon qubits into flip-chip modules. Each module consists of two chips -- one quantum chip and one control chip -- that are bump-bonded together. We demonstrate time-averaged coherence times exceeding $90\,\mu s$, single-qubit gate fidelities exceeding $99.9\%$, and two-qubit gate fidelities above $98.6\%$. We also present device design methods and discuss the sensitivity of device parameters to variation in interchip spacing. Notably, the additional flip-chip fabrication steps do not degrade the qubit performance compared to our baseline state-of-the-art in single-chip, planar circuits. This integration technique can be extended to the realisation of quantum processors accommodating hundreds of qubits in one module as it offers adequate input/output wiring access to all qubits and couplers.<br />Comment: 33 pages, 12 figures, includes supplementary materials, updated with further calculations on participation ratio and Purcell limit
- Subjects :
- Quantum Physics
Subjects
Details
- Database :
- arXiv
- Journal :
- Quantum Science and Technology, 7(3), 035018 (2022)
- Publication Type :
- Report
- Accession number :
- edsarx.2112.02717
- Document Type :
- Working Paper
- Full Text :
- https://doi.org/10.1088/2058-9565/ac734b