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Beam test of a 180 nm CMOS Pixel Sensor for the CEPC vertex detector
- Publication Year :
- 2023
-
Abstract
- The proposed Circular Electron Positron Collider (CEPC) imposes new challenges for the vertex detector in terms of pixel size and material budget. A Monolithic Active Pixel Sensor (MAPS) prototype called TaichuPix, based on a column drain readout architecture, has been developed to address the need for high spatial resolution. In order to evaluate the performance of the TaichuPix-3 chips, a beam test was carried out at DESY II TB21 in December 2022. Meanwhile, the Data Acquisition (DAQ) for a muti-plane configuration was tested during the beam test. This work presents the characterization of the TaichuPix-3 chips with two different processes, including cluster size, spatial resolution, and detection efficiency. The analysis results indicate the spatial resolution better than 5 $\mu m$ and the detection efficiency exceeds 99.5 % for both TaichuPix-3 chips with the two different processes.
- Subjects :
- Physics - Instrumentation and Detectors
High Energy Physics - Experiment
Subjects
Details
- Database :
- arXiv
- Publication Type :
- Report
- Accession number :
- edsarx.2311.05932
- Document Type :
- Working Paper