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Copper-Nickel/SiC composites for applications on contact electrodes

Authors :
Isidro Cruz-Cruz
Roberto Hernández-Maya
José Emiliano Reséndiz-Hernández
Daniel Olvera-Trejo
Oscar Martínez-Romero
Nicolas A. Ulloa Castillo
Alex Elías-Zúñiga
Source :
Heliyon, Vol 10, Iss 22, Pp e39965- (2024)
Publication Year :
2024
Publisher :
Elsevier, 2024.

Abstract

Novel copper-nickel matrix composites reinforced with silicon carbide (SiC) micro particles for metal contact applications were manufactured by powder metallurgy technology and were experimentally characterized. Cu and Cu alloys are commonly used as metal contact for either vacuum, oil, or SF6 in low-voltage circuit breaker devices, but their application in environments with the presence of oxygen is limited due to their tendency to form high-resistance copper oxides. Thus, the addition of Ni as an alloying element provides resistance to both humidity and several corrosive environments and increases the composites' hardness, mechanical strength, and wear resistance. Moreover, SiC was chosen due to its contribution to mechanical strength, mouldability, low production cost, and non-reactive nature at ordinary temperatures. Here, three SiC particle size distributions were considered, and it was found that the composites' physical properties are also dependent on the ceramic loading. After evaluating these properties, two specific SiC concentrations were potentially considered for electrode applications: 10 wt% and 20 wt%. The obtained hardness values are in the range of 55–65 HR30T which guarantees the necessary strength without detriment of the contact area whereas the welding is minimized. In addition to a homogeneous particle distribution in the solid material, specific wear resistance of ∼10−5 mm3N−1m−1 and electrical conductivities of ∼20 %IACS were obtained. Considering these parameters, Cu-Ni/SiC composites' performance is not compromised compared to commercial Ag/WC materials commonly used in metal contact applications.

Details

Language :
English
ISSN :
24058440
Volume :
10
Issue :
22
Database :
Directory of Open Access Journals
Journal :
Heliyon
Publication Type :
Academic Journal
Accession number :
edsdoj.07e984a4f3246e28d7eec88d75c7d70
Document Type :
article
Full Text :
https://doi.org/10.1016/j.heliyon.2024.e39965