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Evolution of Microstructure, Texture and Topography during Cold Rolling and Recrystallization of Ni–5at.%W Alloy Substrate for Coated Conductors

Authors :
Chenxi Zhang
Hongli Suo
Zili Zhang
Qiuliang Wang
Yingxia Wang
Lin Ma
Min Liu
Yaotang Ji
Jiazhi Li
Source :
Crystals, Vol 9, Iss 11, p 604 (2019)
Publication Year :
2019
Publisher :
MDPI AG, 2019.

Abstract

In this work, the effect of cold rolling and heat treatment upon the microstructure and texture of the surface layer and cross-section of Ni5W alloy substrate was analyzed via the EBSD technique. A typical copper deformation texture was shown by the cold-rolled Ni5W alloy substrate. The cube-oriented nuclei were attributed to the rolling direction−transverse direction (RD-TD) plane due to the presence of copper and S rolling textures. Typical large-shape cold-rolled microstructure was presented by the RD-ND surface in the cube-oriented area. During the recrystallization process, the cube-oriented grains did not have a nucleation quantity advantage, but they did have an obvious growth advantage compared with other orientation grains. They can form a strong cube texture by absorbing the random orientation and rolling orientation through the migration of large-angle grain boundaries.

Details

Language :
English
ISSN :
20734352
Volume :
9
Issue :
11
Database :
Directory of Open Access Journals
Journal :
Crystals
Publication Type :
Academic Journal
Accession number :
edsdoj.07f843f8d6b4957a9662559b6bb2248
Document Type :
article
Full Text :
https://doi.org/10.3390/cryst9110604