Cite
Undeformed chip thickness characteristics in grain-workpiece contact zone in ultrasonic vibration assisted grinding
MLA
Kun ZHANG, et al. “Undeformed Chip Thickness Characteristics in Grain-Workpiece Contact Zone in Ultrasonic Vibration Assisted Grinding.” Jin’gangshi Yu Moliao Moju Gongcheng, vol. 42, no. 1, Feb. 2022, pp. 88–96. EBSCOhost, https://doi.org/10.13394/j.cnki.jgszz.2021.0109.
APA
Kun ZHANG, Zhen YIN, Chenwei DAI, Qing MIAO, & Qihui CHENG. (2022). Undeformed chip thickness characteristics in grain-workpiece contact zone in ultrasonic vibration assisted grinding. Jin’gangshi Yu Moliao Moju Gongcheng, 42(1), 88–96. https://doi.org/10.13394/j.cnki.jgszz.2021.0109
Chicago
Kun ZHANG, Zhen YIN, Chenwei DAI, Qing MIAO, and Qihui CHENG. 2022. “Undeformed Chip Thickness Characteristics in Grain-Workpiece Contact Zone in Ultrasonic Vibration Assisted Grinding.” Jin’gangshi Yu Moliao Moju Gongcheng 42 (1): 88–96. doi:10.13394/j.cnki.jgszz.2021.0109.