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An Experimentally Verified Temperature Dependent Drain Current Fluctuation Model for Low Temperature Applications

Authors :
Ying Sun
Yuchen Gu
Jing Wan
Xiao Yu
Bing Chen
Dawei Gao
Ran Cheng
Genquan Han
Source :
IEEE Journal of the Electron Devices Society, Vol 12, Pp 345-349 (2024)
Publication Year :
2024
Publisher :
IEEE, 2024.

Abstract

In this work, an accurate temperature-dependent drain current $I_{\mathrm { D}}$ fluctuation model valid from 10 to 300 K was proposed for 18 nm ultra-thin body and buried oxide (UTBB) n-channel field effect transistors (n-FETs). The temperature dependence of $I_{\mathrm { D}}$ fluctuation was characterized and investigated from 300 K down to 10 K. In moderate inversion mode, $I_{\mathrm { D}}$ fluctuation is more severe at sub-100 K while in the strong inversion mode, it still can be overshadowed by the charge screening effect. Cryogenic virtual source (CVS) device model was used to extract and analyze the carrier density and mobility which are used in the current fluctuation model. The current fluctuation model was experimentally verified under different inversion conditions, showing it can be used to analyze and optimize the flicker noise in the low temperature (LT) circuit applications.

Details

Language :
English
ISSN :
21686734
Volume :
12
Database :
Directory of Open Access Journals
Journal :
IEEE Journal of the Electron Devices Society
Publication Type :
Academic Journal
Accession number :
edsdoj.15c620d5f8b4407facfa46b79e1c36eb
Document Type :
article
Full Text :
https://doi.org/10.1109/JEDS.2024.3388840