Study on the formability of copper foils during multi-step micro deep drawing

In this work, the formability of copper foils was analyzed based on a series of multi-step micro deep drawing (MMDD) tests. The copper foils were annealed at temperatures ranging from 300 to 700 °C for 5 min, followed by tensile tests and electron backscatter diffraction (EBSD) tests for the exploration of mechanical behavior and microstructural characterization of annealed specimens. The results show that the as-received copper foils exhibit poor formability and cannot form micro cups during MMDD. When the annealing temperature attains 500 °C, a homogeneous microstructure was formed inside copper foils, enhancing the formability of materials and improving the surface quality of formed products. Nevertheless, both the elongation and tensile strength decrease dramatically due to the easy occurrence of incoordination deformation in coarse grain bands with further increase in annealing temperature to 700 °C. Consequently, marked wrinkling is generated on the surface of drawn cups and obvious thinning occurs at the nose radius region due to metal flow. In addition, the results show that the E texture component within the copper foils is favorable for MMDD. Overall, an optimal annealing temperature of 500 °C is obtained with improved formability of copper foils and forming quality of drawn cups.