Large-Scale High-Accuracy and High-Efficiency Phase Plate Machining

In this paper, multifunctional, multilevel phase plates of quartz substrate were efficiently prepared by using a newly developed polygon scanner-based femtosecond laser photolithography system combined with inductively coupled discharge plasma reactive-ion etching (ICP-RIE) technology. The femtosecond laser photolithography system can achieve a scanning speed of 5 m/s and a preparation efficiency of 15 cm2/h while ensuring an overlay alignment accuracy of less than 100 nm and a writing resolution of 500 nm. The ICP-RIE technology can control the etching depth error within ±5 nm and the mask-to-mask edge error is less than 1 μm. An 8-level Fresnel lens phase plate with a focal length of 20 mm and an 8-level Fresnel axicon phase plate with a cone angle of 5° were demonstrated. The diffraction efficiency was greater than 93%, and their performance was tested for focusing and glass cutting, respectively. Combined with the high-speed femtosecond laser photolithography system’s infinite field-of-view (IFOV) processing capability, the one-time direct writing preparation of phase plate masks of different sizes was realized on a 6-inch wafer. This is expected to reduce the production cost of quartz substrate diffractive optical elements and promote their customized mass production.