Numerical Investigation on High-Performance Cu-Based Surface Plasmon Resonance Sensor for Biosensing Application

This numerical research presents a simple hybrid structure comprised of TiO2-Cu-BaTiO3 for a modified Kretschmann configuration that exhibits high sensitivity and high resolution for biosensing applications through an angular interrogation method. Recently, copper (Cu) emerged as an exceptional choice as a plasmonic metal for developing surface plasmon sensors (SPR) with high resolution as it yields finer, thinner SPR curves than Ag and Au. As copper is prone to oxidation, especially in ambient conditions, the proposed structure involves the utilization of barium titanate (BaTiO3) film as a protection layer that not only preserves Cu film from oxidizing but enhances the performance of the sensor to a great extent. Numerical results also show that the utilization of a thin adhesive layer of titanium dioxide (TiO2) between the prism base and Cu film not only induces strong interaction between them but also enhances the performance of the sensor. Such a configuration, upon suitable optimization of the thickness of each layer, is found to enhance sensitivity as high as 552°/RIU with a figure of merit (FOM) of 136.97 RIU−1. This suggested biosensor design with enhanced sensitivity is expected to enable long-term detection with greater accuracy and sensitivity even when using Cu as a plasmonic metal.