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Prediction and Effect Verification of Thiamine as a Leveling Agent in Chip Wafer Electroplating
- Source :
- ACS Omega, Vol 8, Iss 48, Pp 45495-45501 (2023)
- Publication Year :
- 2023
- Publisher :
- American Chemical Society, 2023.
Details
- Language :
- English
- ISSN :
- 24701343
- Volume :
- 8
- Issue :
- 48
- Database :
- Directory of Open Access Journals
- Journal :
- ACS Omega
- Publication Type :
- Academic Journal
- Accession number :
- edsdoj.2774394bf69f4aabbb3d206ed3129edb
- Document Type :
- article
- Full Text :
- https://doi.org/10.1021/acsomega.3c05248