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Micromechanical behaviors related to confined deformation in pure titanium
- Source :
- MATEC Web of Conferences, Vol 321, p 12018 (2020)
- Publication Year :
- 2020
- Publisher :
- EDP Sciences, 2020.
-
Abstract
- Confined deformation, e.g. mechanical twinning, shear banding, and Lüders banding, etc. was extensively observed in metals and alloys with low stacking-fault energies, especially under complex loadings, governing the mechanical properties. It is often accompanied with gradient microstructures to accommodate the stress concentrations. Understanding the micromechanical behaviors of structural materials having confined deformation is important for evaluating the structural stabilities of engineering components. Synchrotron-based techniques provide powerful tools for multiscale microstructural characterization owing to their good resolution in real/reciprocal space, fast data collection/processing and flexible application scenarios. In this paper, the synchrotron-based high-energy X-ray diffraction (HE-XRD) and microdiffraction (μXRD) techniques in combination with traditional characterization methods are used to reveal the deformational gradient structures/stresses under different loading modes in multiscale. The structure/stress gradients induced by laser shot peening treatment and the deformation twins generated during uniaxial tensile loading in pure titanium were systematically studied by HE-XRD and μXRD, in order to elucidate the accommodating role of the deformational structures subjected to various confined scenarios. The new finding regarding the micromechanical behaviors related to confined deformation contributes to the in-depth understanding of related complex deformation behaviors.
Details
- Language :
- English, French
- ISSN :
- 2261236X
- Volume :
- 321
- Database :
- Directory of Open Access Journals
- Journal :
- MATEC Web of Conferences
- Publication Type :
- Academic Journal
- Accession number :
- edsdoj.2d0a6a1c75e47efaedff6fe6d53da1e
- Document Type :
- article
- Full Text :
- https://doi.org/10.1051/matecconf/202032112018