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Heat Transfer Performance of a Novel Microchannel Embedded with Connected Grooves
- Source :
- Chinese Journal of Mechanical Engineering, Vol 34, Iss 1, Pp 1-11 (2021)
- Publication Year :
- 2021
- Publisher :
- SpringerOpen, 2021.
-
Abstract
- Abstract To improve the heat transfer performance of microchannels, a novel microchannel embedded with connected grooves crossing two sidewalls and the bottom surface (type A) was designed. A comparative study of heat transfer was conducted regarding the performances of type A microchannels, microchannels embedded with grooves on their bottom (including types B and C), or on the sidewalls (type D) as well as smooth rectangular microchannels (type E) via a three-dimensional numerical simulation and experimental validation (at Reynolds numbers from 118 to 430). Numerical results suggested that the average Nusselt number of types A, B, C, and D microchannels were 106, 73.4, 50.1, and 12.6% higher than that of type E microchannel, respectively. The smallest synergy angle β and entropy generation number N s,a were determined for type A microchannels based on field synergy and nondimensional entropy analysis, which indicated that type A exhibited the best heat transfer performance. Numerical flow analysis indicated that connected grooves induced fluid to flow along two different temperature gradients, which contributed to enhanced heat transfer performance.
Details
- Language :
- English
- ISSN :
- 10009345 and 21928258
- Volume :
- 34
- Issue :
- 1
- Database :
- Directory of Open Access Journals
- Journal :
- Chinese Journal of Mechanical Engineering
- Publication Type :
- Academic Journal
- Accession number :
- edsdoj.2e2648d98a99448b835bafe76a381b94
- Document Type :
- article
- Full Text :
- https://doi.org/10.1186/s10033-021-00632-w