Cite
Enhancing the shear strength of the Au–Ge solder joint via forming a ductile face-centered cubic solid solution layer at the interface
MLA
Meng Wang, et al. “Enhancing the Shear Strength of the Au–Ge Solder Joint via Forming a Ductile Face-Centered Cubic Solid Solution Layer at the Interface.” Journal of Materials Research and Technology, vol. 19, no. 605–616, July 2022, pp. 605–16. EBSCOhost, https://doi.org/10.1016/j.jmrt.2022.05.067.
APA
Meng Wang, Huashan Liu, & Jian Peng. (2022). Enhancing the shear strength of the Au–Ge solder joint via forming a ductile face-centered cubic solid solution layer at the interface. Journal of Materials Research and Technology, 19(605–616), 605–616. https://doi.org/10.1016/j.jmrt.2022.05.067
Chicago
Meng Wang, Huashan Liu, and Jian Peng. 2022. “Enhancing the Shear Strength of the Au–Ge Solder Joint via Forming a Ductile Face-Centered Cubic Solid Solution Layer at the Interface.” Journal of Materials Research and Technology 19 (605–616): 605–16. doi:10.1016/j.jmrt.2022.05.067.