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Influence of PUB2 on the Leveling Effect of Chip Copper Connection Electroplating: Mechanism and Applications

Authors :
Lanfeng Guo
Renlong Liu
Zhaobo He
Shaoping Li
Tong Tan
Changyuan Tao
Source :
ACS Omega, Vol 9, Iss 12, Pp 14092-14100 (2024)
Publication Year :
2024
Publisher :
American Chemical Society, 2024.

Subjects

Subjects :
Chemistry
QD1-999

Details

Language :
English
ISSN :
24701343
Volume :
9
Issue :
12
Database :
Directory of Open Access Journals
Journal :
ACS Omega
Publication Type :
Academic Journal
Accession number :
edsdoj.36dde73346b241f6ab5843989329e576
Document Type :
article
Full Text :
https://doi.org/10.1021/acsomega.3c09548