Integrated Inductors for RF Transmitters in CMOS/MEMS Smart Microsensor Systems

This paper presents the integration of an inductor by complementary metal-oxide-semiconductor (CMOS) compatible processes for integrated smart microsensorsystems that have been developed to monitor the motion and vital signs of humans invarious environments. Integration of radio frequency transmitter (RF) technology withcomplementary metal-oxide-semiconductor/micro electro mechanical systems (CMOS/MEMS) microsensors is required to realize the wireless smart microsensors system. Theessential RF components such as a voltage controlled RF-CMOS oscillator (VCO), spiralinductors for an LC resonator and an integrated antenna have been fabricated and evaluatedexperimentally. The fabricated RF transmitter and integrated antenna were packaged withsubminiature series A (SMA) connectors, respectively. For the impedance (50 ) matching,a bonding wire type inductor was developed. In this paper, the design and fabrication of thebonding wire inductor for impedance matching is described. Integrated techniques for theRF transmitter by CMOS compatible processes have been successfully developed. Aftermatching by inserting the bonding wire inductor between the on-chip integrated antennaand the VCO output, the measured emission power at distance of 5 m from RF transmitterwas -37 dBm (0.2 μW).