Rooting binder-free tin nanoarrays into copper substrate via tin-copper alloying for robust energy storage

MLA

Jiangfeng Ni, et al. “Rooting Binder-Free Tin Nanoarrays into Copper Substrate via Tin-Copper Alloying for Robust Energy Storage.” Nature Communications, vol. 11, no. 1, Mar. 2020, pp. 1–8. EBSCOhost, https://doi.org/10.1038/s41467-020-15045-x.

APA

Jiangfeng Ni, Xiaocui Zhu, Yifei Yuan, Zhenzhu Wang, Yingbo Li, Lu Ma, Alvin Dai, Matthew Li, Tianpin Wu, Reza Shahbazian-Yassar, Jun Lu, & Liang Li. (2020). Rooting binder-free tin nanoarrays into copper substrate via tin-copper alloying for robust energy storage. Nature Communications, 11(1), 1–8. https://doi.org/10.1038/s41467-020-15045-x

Chicago

Jiangfeng Ni, Xiaocui Zhu, Yifei Yuan, Zhenzhu Wang, Yingbo Li, Lu Ma, Alvin Dai, et al. 2020. “Rooting Binder-Free Tin Nanoarrays into Copper Substrate via Tin-Copper Alloying for Robust Energy Storage.” Nature Communications 11 (1): 1–8. doi:10.1038/s41467-020-15045-x.