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Corrigendum to 'Comparative study of solder wettability on aluminum substrate and microstructure-properties of Cu-based component/aluminum laser soldering joint' [Mater. Design 215 (2022) 110485]

Authors :
Peng-Cheng Huan
Xiao-Xia Tang
Qian Sun
Kato Akira
Xiao-Nan Wang
Jie Wang
Jia-Le Wang
Xia Wei
Hong-Shuang Di
Source :
Materials & Design, Vol 219, Iss , Pp 110693- (2022)
Publication Year :
2022
Publisher :
Elsevier, 2022.

Details

Language :
English
ISSN :
02641275
Volume :
219
Issue :
110693-
Database :
Directory of Open Access Journals
Journal :
Materials & Design
Publication Type :
Academic Journal
Accession number :
edsdoj.60b4fad18c2f459b97be8e0d48e795ee
Document Type :
article
Full Text :
https://doi.org/10.1016/j.matdes.2022.110693