Heat Transfer Modeling and Oven Temperature Curve Optimization of Integrated Circuit Board Reflow Soldering

MLA

Geng Ma, et al. “Heat Transfer Modeling and Oven Temperature Curve Optimization of Integrated Circuit Board Reflow Soldering.” IEEE Access, vol. 9, Jan. 2021, pp. 141876–89. EBSCOhost, https://doi.org/10.1109/ACCESS.2021.3120496.

APA

Geng Ma, Xiaoqing Huang, & Shihao Liu. (2021). Heat Transfer Modeling and Oven Temperature Curve Optimization of Integrated Circuit Board Reflow Soldering. IEEE Access, 9, 141876–141889. https://doi.org/10.1109/ACCESS.2021.3120496

Chicago

Geng Ma, Xiaoqing Huang, and Shihao Liu. 2021. “Heat Transfer Modeling and Oven Temperature Curve Optimization of Integrated Circuit Board Reflow Soldering.” IEEE Access 9 (January): 141876–89. doi:10.1109/ACCESS.2021.3120496.