Cu3Sn joint based on transient liquid phase bonding of Cu@Cu6Sn5 core–shell particles

MLA

Jintao Wang, et al. “Cu3Sn Joint Based on Transient Liquid Phase Bonding of Cu@Cu6Sn5 Core–shell Particles.” Scientific Reports, vol. 13, no. 1, Jan. 2023, pp. 1–12. EBSCOhost, https://doi.org/10.1038/s41598-023-27870-3.

APA

Jintao Wang, Jianqiang Wang, Fangcheng Duan, & Hongtao Chen. (2023). Cu3Sn joint based on transient liquid phase bonding of Cu@Cu6Sn5 core–shell particles. Scientific Reports, 13(1), 1–12. https://doi.org/10.1038/s41598-023-27870-3

Chicago

Jintao Wang, Jianqiang Wang, Fangcheng Duan, and Hongtao Chen. 2023. “Cu3Sn Joint Based on Transient Liquid Phase Bonding of Cu@Cu6Sn5 Core–shell Particles.” Scientific Reports 13 (1): 1–12. doi:10.1038/s41598-023-27870-3.