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Mini-Review: Modeling and Performance Analysis of Nanocarbon Interconnects

Authors :
Wen-Sheng Zhao
Kai Fu
Da-Wei Wang
Meng Li
Gaofeng Wang
Wen-Yan Yin
Source :
Applied Sciences, Vol 9, Iss 11, p 2174 (2019)
Publication Year :
2019
Publisher :
MDPI AG, 2019.

Abstract

As the interconnect delay exceeds the gate delay, the integrated circuit (IC) technology has evolved from a transistor-centric era to an interconnect-centric era. Conventional metallic interconnects face several serious challenges in aspects of performance and reliability. To address these issues, nanocarbon materials, including carbon nanotube (CNT) and graphene, have been proposed as promising candidates for interconnect applications. Considering the rapid development of nanocarbon interconnects, this paper is dedicated to providing a mini-review on our previous work and on related research in this field.

Details

Language :
English
ISSN :
20763417
Volume :
9
Issue :
11
Database :
Directory of Open Access Journals
Journal :
Applied Sciences
Publication Type :
Academic Journal
Accession number :
edsdoj.bbd51b34e9449e0949ec0975cd3b365
Document Type :
article
Full Text :
https://doi.org/10.3390/app9112174