A review of the cooling methods based on IGBT module and the application of micro-channel cooling in IGBT

The thermal management problem of IGBT is becoming more and more prominent, and it is urgent to develop a new cooling technology with high efficiency, stability and flexibility. Based on the main problems and bottlenecks in the current IGBT module cooling, was conducted a detailed analysis and evaluation of the widely used IGBT cooling technologies, as well as spray cooling, jet impingement cooling technology and micro-channel cooling technology, which are the hot spots of the current research. It shows that compared with other cooling technologies, micro-channel cooling technology, especially microchannel flow boiling cooling technology, has the advantages of compact structure, strong heat transfer capacity, high heat transfer coefficient, less working fluid charge, and good temperature uniformity performance, which have great development prospects in the field of thermal management of electronic devices. Thus, in this paper, it was proposed that microchannel flow boiling cooling is an optimal solution to the thermal management of new electronic devices, which provides an important reference for the design and application of IGBT module heat sinks.