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Correlation between microhardness and microstructure of low-temperature Sn-xBi-M(Ag, Sb) solders
- Source :
- Journal of Materials Research and Technology, Vol 31, Iss , Pp 165-169 (2024)
- Publication Year :
- 2024
- Publisher :
- Elsevier, 2024.
-
Abstract
- The correlation between Vickers microhardness and microstructure of low-temperature Sn-xBi-M(Ag, Sb) solders was investigated. The β-Sn grains were refined with increasing Bi content, as well as the additions of Ag and Sb. Fine β-Sn grains in general should strengthen the mechanical properties of solders, however, the Vickers microhardness of Sn-xBi-M(Ag, Sb) solders decreased with increasing Bi content (i.e., fine β-Sn grains). It was shown that the microhardness of Sn-xBi-M(Ag, Sb) solders depended on the amount of Bi/β-Sn interfaces rather than the fine-grain strengthening effect. The smaller the amount of Bi/β-Sn interfaces was, the higher the Vickers microhardness of Sn-xBi-M(Ag, Sb) solders.
Details
- Language :
- English
- ISSN :
- 22387854
- Volume :
- 31
- Issue :
- 165-169
- Database :
- Directory of Open Access Journals
- Journal :
- Journal of Materials Research and Technology
- Publication Type :
- Academic Journal
- Accession number :
- edsdoj.f4079c145dcd4220ac79a2f26dec0b56
- Document Type :
- article
- Full Text :
- https://doi.org/10.1016/j.jmrt.2024.06.063