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Tuning the microstructure and enhancing the mechanical properties of Au-20Sn/Au/Ni(P)/Kovar joint by ultrasonic-assisted soldering method

Authors :
Baishan Chen
Yufeng Huang
Siwei Tang
Wensheng Liu
Yunzhu Ma
Source :
Journal of Materials Research and Technology, Vol 14, Iss , Pp 703-718 (2021)
Publication Year :
2021
Publisher :
Elsevier, 2021.

Abstract

Improving the reliability of the solder joint has been the recent research focus in the electronic packaging field due to the increasing degree of integration in the electronic devices. During the reflow soldering process, when the local component is heterogeneous, the coarse structure of the solder joint is easy to grow, which deteriorates the performance of the solder joint. In this study, Au-20Sn/Au/Ni(P)/Kovar joints were prepared using ultrasonic-assisted reflow soldering process. Ultrasonication during reflow improved the wettability and shear strength between the Au-20Sn solder and Kovar substrate. The applied ultrasound can break the primary Au5Sn grain and refine the eutectic microstructure through acoustic cavitation. Meanwhile, ultrasound induced the formation of a new intermetallic compound (IMC) layer that was identified as Ni3P (ca 120 nm), which inhibited the diffusion of Ni from substrate into the solder matrix. The mechanical properties of Au-20Sn/Au/Ni(P)/Kovar joint treated with 80 W ultrasonic vibration (USV) increased by 46.94% as compared to the control sample. The current study provides a new strategy for high-performance packaging in electronic devices in extreme environments.

Details

Language :
English
ISSN :
22387854
Volume :
14
Issue :
703-718
Database :
Directory of Open Access Journals
Journal :
Journal of Materials Research and Technology
Publication Type :
Academic Journal
Accession number :
edsdoj.f5404d5a8c04a9daa7a91b92d245330
Document Type :
article
Full Text :
https://doi.org/10.1016/j.jmrt.2021.06.100